Modular housing with integrated cooling solution

The BoVersa series from BOPLA is a modular enclosure system that combines functionality, thermal design, and industrial design in a single platform, developed for IoT, embedded, and wireless systems.

The BoVersa series from BOPLA is a modular enclosure system that combines functionality, thermal design, and industrial design in a single platform. The series has been developed for IoT, embedded, and wireless systems where mechanical flexibility and heat dissipation play an important role.

BoVersa is constructed according to a three-part concept: a base, a functional lid, and a designer cover. This allows enclosures to be easily configured for a wide range of applications.

The base plate is available in high-quality polycarbonate (PC, UL94-V0) or as an aluminum base, which directly functions as a heat sink for power electronics. This integrated cooling function often eliminates the need for an external cooling profile, without compromising aesthetics.

The functional covers are available in closed, transparent, or translucent versions, suitable for displays, status lighting, or light guides. BoVersa is available in multiple sizes and heights and can be used as a wall housing, mast mount, tabletop model, or handheld.

As usual with Bopla, the enclosures can be mechanically processed ex-factory, fitted with cable entries, display openings, and printing, which simplifies integration into serial applications