Accelonix BV
About us
Accelonix BV provides solutions for the assembly, inspection and testing of electronics & microelectronics applications.
During the Advanced Engineering we will showcase our services for:
- Prototype assembly of microelectronics (die and wire bonding, battery bonding)
- Testing of PCBAs (X-Ray Inspection, Flying Probe and JTAG)
Equipment on display are:
- Dispensing equipment - pumps, valves and robots - for semiconductor and PCB application
- EMC simulators for ESD
- NEW FlashFOX In-System-Programming tools
- PCB Design for Test & Manufacturing (DfX) Software
Accelonix BV provides equipment and solutions for:
- Micro-Electronics Assembly: Dicing, Dispensing, Die Sorting, Die and Wire Bonding, Battery Bonding and Bond Testing
- PCBA Inspection & Test: Solder Paste Inspection , 3D AOI and X-Ray Inspection, Flying Probe Test, JTAG/Boundary Scan Test, Device Programming and Software for DfX, NPI & Traceability
- Metrology: Non-Contact Surface Metrology, Thermal Warpage/Strain & X-Ray µCT
- EMC: ESD & Transient testing, RF Emissions, RF Immunity, Measurement Chambers and Test Cells, EMC Filters for power lines, HEMP, Tempest.
Products
TPT Wire Bonders
The TPT wire bonders for fine wire applications include a bondhead to support ball bonding, stud bumping, as well as deep access wedge bonding capabilities with wire diameters down to 17µm. The heavy wire TPT bonders support wire diameters up to 500µm and support appilications for power semiconductors and battery packs. The TPT machines are used in production and research of microelectronics and interconnection of semiconductors and battery cells and are found in Universities, R&D institutes and low volume production applications. The TPT equipment is easy to use and have low operating costs. Their flexibility for optimizing the bonding parameters ensures a high bond quality and reliability even for the most challenging wire bonding applications.
EM Test Compact NX5 EMC Burst/Surge Transient Simulator
Compact Tester for EFT/Burst, Surge and PowerFail The compact Next Generation NX5 is the most versatile tester to address transient and power fail requirements for both international and commercial standards. Featuring an easy-to-use color touch screen, the NX5 provides an economical solution for pre-compliance immunity testing as well as full-compliance testing and CE Marking. Its internal single-phase Coupling/Decoupling Network (CDN) can be extended for testing three-phase EUTs by means of an automatically controlled external CDN up to 200 A per phase. EM TEST supplies a large range of accessories for various applications such as magnetic field tests and more. Features: - Smallest compact generator with 7" touch screen - Burst 5.5 kV, Surge 5.0 kV and Power Fail - Built-in single phase CDN 400 V/32 A - Manual front panel operation with setup pictures - Separate key for START/STOP operation with LED - Monitor outputs for peak voltage and current - Opto-Link and Ethernet for remote control - Control of external three-phase couplers
ESD NX30 Simulator
Generates ESD pulses according to IEC 61000-4-2 and ISO 10605. Electrostatic discharges either from a human body to any other part or between two different objects can cause persistent disturbances or even destruction to sensitive electronics or controls. esd NX30 is an ESD gun to simulate ESD pulses at higher voltages up to 30 kV in both air and contact discharge mode. It therefore satisifiers requirements exceeding the EN/IEC 61000-4-2 test levels and complies to automotive test applications. Features: - Air- and contact-discharge to 30 kV - Color touch panel control - Discharges up to 30 Hz - 80 easy-to-change R/C-networks and tips - Switchable Bleed-Off function - Built-in activity log - Optional battery tested to 30,000 pulses @30 kV
DfX Software for PCBA-Level analysis of Manufacturability, Assembly, Testability and Test Coverage validation
Verify, Assemble and Test PCBAs We provide the Aster Technologies software tools to simulate a PCBA and the manufacturing/test machines in a digital environment. Traditionally, manufacturing and test constraints are only considered at the end of the layout phase, prior to transfer of the CAD data to production. Due to board complexity, it is now mandatory to consider a validation stage at each step of the design and manufacturing phases. The Testway Express software for Design for Test makes it possible to implement a Lean Test approach that produces a lower cost product whilst maintaining the highest quality. TestWay has been developed to allow users to analyze each stage of the design to delivery workflow. This is achieved by the following stages: - Electrical Design for Test – Verifies electrical DfT guide lines and includes standard and customer’s specific checks and requirements. Simulates the test strategy prior to the layout phase. - Mechanical Design for Test – Optimizes test probe placement, estimates the test coverage and calculates the production yield and TL9000 initial return rates. - NPI/CADCAM data export – Includes Automated Placement Machines, AOI, AXI, JTAG/Boundary Scan, Flying-probe Test, ICT and Functional Test. Exports the CAD data into the native format useable by the production and test machines. - Test for Excellence – Compares the estimated coverage and completed test programs. DfMExpress is a fully integrated DfM software enabling designers and electronic manufacturers to validate layout designs, prior to fabrication. Design for Manufacturing (DfM) is the process of qualifying if PCB and PCBA are manufacturable and reliable at the best price: - Design for MANUFACTURING: PCB fabrication is a complex operation, subject to a number of restrictions linked with cop - Design for ASSEMBLY: The automated assembly process will combine THT and SMD components to be placed and soldered on the bare board. Contact us for a demonstratuin!
TPT HB30 Heavy Wire Bonder with automatic Z- & Y- Axis is ideal for Battery Bonding.
The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines. The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease. Wire sizes up to 650μm can be processed resulting in a wide field of applications in semiconductor and sensor products. The heavy wire bonding (≥100μm) is more suitable for batteries and power applications, e.g. inverters, switching devices or control units. Power applications typically use 75μm up to 650μm aluminium wire, but copper wire or ribbon can also be processed.
Musashi Desktop Dispensing Robot
Desktop dispensing robot with PC-controlled image detection Enhance Precision in Your Production with the Image Master 350PC Smart from Musashi Engineering The Image Master 350PC Smart epitomizes advanced dispensing technology, designed to achieve unmatched accuracy in complex adhesive applications. This system is compatible with a large variaty of pumps and valves and excels in dispensing and coating applications that demand the highest precision and efficiency. Key Features: - Advanced 3D Alignment: Adjusts for XYθ and corrects Z-axis variations to ensure precise application on varied surface topographies. - Automated Production Monitoring: Streamlines the production cycle from start to finish with automated monitoring and data logging for enhanced traceability. - Innovative Edge Detection: Ensures accurate alignment despite changes in workpiece shape or imperfections. - Dispensing Preview: Offers a preview of the dispensing pattern, allowing for precise adjustments prior to application. - Efficient and User-Friendly: Simplifies operations with easy setup features and intuitive pattern editing via MuCADV software. Discover how the Image Master 350PC Smart can revolutionize your dispensing processes, increasing both precision and throughput.
Assembly and Test Services provided by Accelonix
At Accelonix BV, our PCB Contract Assembly and Test Services meet the evolving demands of the electronics industry by providing fast, flexible, and cost-effective solutions for assembling micro electronics and for testing printed circuit board assemblies. We specialize in helping R&D, prototype and low volume production accelerate their time-to-market while ensuring the highest quality standards. We provide local services for: - Flying Probe PCBA Test - JTAG/Boundary Scan Test - X-Ray Inspection and Computed Tomography Analysis - Microelectronics die and wire bonding - Wafer Dicing - Battery bonding Furthermore, many of our Manufacturing Partners offer Contract Services to support Low Volume and Prototype Production. We would welcome your enquiry and be pleased to discuss your requirements in order to propose suitable Contract Service solutions.
FlashFOX ISP Flash Programmer by Goepel electronic
The Goepel electronic stand-alone programmer FlashFOX is a proven tool for embedded in-system programming (ISP) of microcontrollers, flash devices, and PLD/FPGA devices. FlashFOX can be easily adapted to different programming requirements. The number of programming channels is scalable and allows simultaneous programming of several devices on one PCBA or several PCBA in parallel. As the world's first stand-alone programmer, the device features an integrated JAM/STAPL player that conforms to the JESD71 standard, extending FlashFOX's capabilities to perform standardized test and programming operations independently on each channel. The distance between FlashFOX and connected interface PODs can be as long as 4 m, which causes signal delays that have the potential to negatively impact performance. The new ADYCS automation feature provides automatic calculation of and compensation for these delays, ensuring consistent performance for each programmer channel, independent of the distance to the target and even in complex system configurations. A new Streaming Mode has also been introduced as a supplement to the existing stand-alone mode. The significant difference lies in programming data being pulled dynamically from a central server, instead of using images stored locally in the programmer. This makes it possible to handle dynamically encrypted and target-specific (unique) data, which significantly increases versatility and opens up new use case possibilities. FlashFOX is the first programmer worldwide with Wi-Fi connectivity – for easy integration into the IoT world and support for flexible Industry 4.0 implementations. The integration of a web server, also a first among programmers, allowing FlashFOX to be easily and securely configured, controlled, and interrogated via any web browser, without the need for additional software. The FlashFOX comes in 4- and 8-channel versions. These can be cascaded for maximum flexibility.