Accelonix BV

Teseq NSG 4070D - NSG 4070D - The New Standard for RF Conducted Immunity Testing

Musashi Desktop Dispensing Robot

FlashFOX ISP Flash Programmer by Goepel electronic

The Goepel electronic stand-alone programmer FlashFOX is a proven tool for embedded in-system programming (ISP) of microcontrollers, flash devices, and PLD/FPGA devices. FlashFOX can be easily adapted to different programming requirements. The number of programming channels is scalable and allows simultaneous programming of several devices on one PCBA or several PCBA in parallel. As the world's first stand-alone programmer, the device features an integrated JAM/STAPL player that conforms to the JESD71 standard, extending FlashFOX's capabilities to perform standardized test and programming operations independently on each channel. The distance between FlashFOX and connected interface PODs can be as long as 4 m, which causes signal delays that have the potential to negatively impact performance. The new ADYCS automation feature provides automatic calculation of and compensation for these delays, ensuring consistent performance for each programmer channel, independent of the distance to the target and even in complex system configurations. A new Streaming Mode has also been introduced as a supplement to the existing stand-alone mode. The significant difference lies in programming data being pulled dynamically from a central server, instead of using images stored locally in the programmer. This makes it possible to handle dynamically encrypted and target-specific (unique) data, which significantly increases versatility and opens up new use case possibilities. FlashFOX is the first programmer worldwide with Wi-Fi connectivity – for easy integration into the IoT world and support for flexible Industry 4.0 implementations. The integration of a web server, also a first among programmers, allowing FlashFOX to be easily and securely configured, controlled, and interrogated via any web browser, without the need for additional software. The FlashFOX comes in 4- and 8-channel versions. These can be cascaded for maximum flexibility.

EM Test Compact NX5 EMC Transient Simulator

Compact Tester for EFT/Burst, Surge and PowerFail The compact Next Generation NX5 is the most versatile tester to address transient and power fail requirements for both international and commercial standards. Featuring an easy-to-use color touch screen, the NX5 provides an economical solution for pre-compliance immunity testing as well as full-compliance testing and CE Marking. Its internal single-phase Coupling/Decoupling Network (CDN) can be extended for testing three-phase EUTs by means of an automatically controlled external CDN up to 200 A per phase. EM TEST supplies a large range of accessories for various applications such as magnetic field tests and more. Features: - Smallest compact generator with 7" touch screen - Burst 5.5 kV, Surge 5.0 kV and Power Fail - Built-in single phase CDN 400 V/32 A - Manual front panel operation with setup pictures - Separate key for START/STOP operation with LED - Monitor outputs for peak voltage and current - Opto-Link and Ethernet for remote control - Control of external three-phase couplers

Assembly and Test Services provided by Accelonix

TPT Wire Bonders

The TPT wire bonders for fine wire applications include a bondhead to support ball bonding, stud bumping, as well as deep access wedge bonding capabilities with wire diameters down to 17µm. The heavy wire TPT bonders support wire diameters up to 500µm and support appilications for power semiconductors and battery packs. The TPT machines are used in production and research of microelectronics and interconnection of semiconductors and battery cells and are found in Universities, R&D institutes and low volume production applications. The TPT equipment is easy to use and have low operating costs. Their flexibility for optimizing the bonding parameters ensures a high bond quality and reliability even for the most challenging wire bonding applications.

ESD NX30 Simulator

Generates ESD pulses according to IEC 61000-4-2 and ISO 10605. Electrostatic discharges either from a human body to any other part or between two different objects can cause persistent disturbances or even destruction to sensitive electronics or controls. esd NX30 is an ESD gun to simulate ESD pulses at higher voltages up to 30 kV in both air and contact discharge mode. It therefore satisifiers requirements exceeding the EN/IEC 61000-4-2 test levels and complies to automotive test applications. Features: - Air- and contact-discharge to 30 kV - Color touch panel control - Discharges up to 30 Hz - 80 easy-to-change R/C-networks and tips - Switchable Bleed-Off function - Built-in activity log - Optional battery tested to 30,000 pulses @30 kV

DfX Software for PCBA-Level analysis of Manufacturability, Assembly, Testability and Test Coverage validation

The Testway Express software for Design for Excellence makes it possible to implement a Lean Test approach that produces a lower cost product whilst maintaining the highest quality. Our vision is articulated on two principles: - Using traceability and repair loop information in order to qualify the customer defect universe. The defects include design defects, manufacturing defects and functional defects. - Using TestWay to import the defect opportunities and identify the possible consequences of inadequate testability and test coverage on a new design. Traditionally, manufacturing and test constraints are only considered at the end of the layout phase, prior to transfer of the CAD data to production. Due to board complexity, it is now mandatory to consider a validation stage at each step of the design and manufacturing phases. TestWay has been developed to allow users to analyze each stage of the design to delivery workflow. This is achieved by the following stages: - Design for Component – Checks ROHS, reliability, DPMO, BSDL file validation in order to guide component selection. - Electrical Design for Test – Verifies electrical DfT guide lines and includes standard and customer’s specific checks and requirements. Simulates the test strategy prior to the layout phase, Aligns the need for physical accesses with the defect universe. Helps to reduce test point access by 30% to 70%! - Mechanical Design for Test – Optimizes test probe placement, estimates the test coverage and calculates the production yield and TL9000 initial return rates. - Design to Build and Design to Test – Include Automated Placement Machines, AOI, AXI, JTAG/Boundary Scan, Flying-probe Test, ICT and Functional Test. Exports the CAD data into the native format useable by the production and test machines as well as test fixture files. - Test for Excellence – Compares the estimated coverage and completed test progams.

TPT HB30 Heavy Wire Bonder met automatische Z- & Y-as is ideaal voor bonden van cellen in battery packs

De HB30 is een tafelmodel bonder, gemakkelijk te gebruiken en ideaal voor laboratoria, proto producties en kleinschalige productielijnen. De HB30 heeft een gemotoriseerde Y- en Z-as voor een betere controle over de loopparameters, zodat de gebruiker met gemak consistente en herhaalbare verbindingen kan maken. Draaddiktes tot 650μm kunnen worden verwerkt, wat resulteert in een breed toepassingsgebied in halfgeleider- en sensorproducten. De zware draadbinding (≥100μm) is meer geschikt voor batterijen en vermogenstoepassingen, bv. omvormers, schakelapparatuur of besturingseenheden. Voor vermogenstoepassingen wordt meestal aluminiumdraad van 75μm tot 650μm gebruikt, maar ook koperdraad of ribbon kan worden verwerkt.