Thermal management of electronic components and systems is more challenging than ever. Power densities continue to increase, while product form factors continue to shrink.
Engineers must now consider thermal management early on in the product development cycle to make sure sufficient space and power is available to remove heat from their system. Laird developed Liquid cooling systems (LCS), which are self‐contained units that recirculate a coolant to a predefined temperature set point. There are two types of liquid cooling solutions: a liquid heat exchanger system and a compressor‐based system. More information about these liquid cooling solutions can be found at Liquide Cooling Systems Laird.
In addition Mecc.Al has been developing a series of different technical proposals for the production of liquid cooled plates for years. Different manufacturing technologies which can be used for every single customized project according to the peculiar exigencies of the project itself. The aim is to design and supply always the best technical, thermal and economical solution. Mecc.Al LCP range has been shared into 4 different families of products where each of them is defined according to a different peculiar manufacturing technology and, at the same time, extremely flexible and versatile, customized by following the requirements of the design itself. The materials which are used are aluminium in different alloys, copper, brass and stainless steel.
For more information:MeccAl Liquid Cold Plate Technologies
More information? Please contact: info@telerex-europe.com
