The TPT wire bonders for fine wire applications include a bondhead to support ball bonding, stud bumping, as well as deep access wedge bonding capabilities with wire diameters down to 17µm.
The heavy wire TPT bonders support wire diameters up to 500µm and support appilications for power semiconductors and battery packs.
The TPT machines are used in production and research of microelectronics and interconnection of semiconductors and battery cells and are found in Universities, R&D institutes and low volume production applications.
The TPT equipment is easy to use and have low operating costs. Their flexibility for optimizing the bonding parameters ensures a high bond quality and reliability even for the most challenging wire bonding applications.
