The HB30 is a bench top size heavy wirebonder, easy to use and ideal for laboratories, pilot production runs and small scale production lines.
The HB30 benefits from a motorised Y and Z axis giving a greater control over the looping parameters, allowing the user to create consistent and repeatable wire bonds with ease.
Wire sizes up to 650μm can be processed resulting in a wide field of applications in semiconductor and sensor products. The heavy wire bonding (≥100μm) is more suitable for batteries and power applications, e.g. inverters, switching devices or control units. Power applications typically use 75μm up to 650μm aluminium wire, but copper wire or ribbon can also be processed.
